PATTERN STRUCTURE FOR PACKAGE, PACKAGE FOR ELECTRONIC COMPONENT USING SAME AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT USING PACKAGE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a pattern structure for a package that enables sealing with precision by precisely forming a sealing material although the cost is low, a package for an electronic component which uses the same and a manufacturing method thereof, and an electronic component using the package for the electronic component.;SOLUTION: In the pattern structure, a sealing part airtightly sealing the space inside a peripheral edge of the package 31 for storing a circuit component is formed by plating along the peripheral edge of the package 31. In the pattern structure for the package, a 1st wiring pattern 21 for wiring the circuit component and a 2nd wiring pattern for sealing provided along the peripheral edge are provided, and the 1st wiring pattern and 2nd wiring pattern 22 are divided by systems and led out to an outer side individually and respectively.;COPYRIGHT: (C)2006,JPO&NCIPI