Fundamental Studies of Electronic Packaging Materials and Structures: Surface andInterfaces

摘要

Layered structures consisting of metals, ceramics and polymers are usedextensively for signal and power distribution both at the chip level and in electronic packages. The structural integrity of the interfaces between layers in such structures is an important consideration in the design and fabrication of a variety of devices and components. Various variables including surface composition and structure that control interfacial adhesion are investigated. Interfaces between metal/ceramic, metal/polymer and between polymer/polymer are studied in the research reported.