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Packaging body for microwave oven heating with conductive heating layer and heating method of food material sealed therein

机译:用于微波炉加热的包装体,导电加热层和其中密封的食品材料的加热方法

摘要

Problem to be solved: to provide a microwave oven heating packaging body having a conductive heat generating layer which generates heat in a desired state regardless of the output state of the microwave irradiation and a heating method of the food material sealed therein.A packaging body (100) for microwave oven heating includes a first sheet member (1).A conductive heat generating layer (14) is formed on the first sheet member (1) in addition to the substrate layer (12) and the sealant layer (13).A conductive heating layer (14) is provided with a plurality of islands including conductive material made of an organic compound, and a bridge portion including the conductive material and connecting an adjacent island portion.In the microwave oven heating, the conductive heat generating layer (14) generates heat, thereby reducing a portion of the sealant layer (13) adjacent to the portion (the outlet of the steam outlet (5)) to form a steam outlet.When the output state of the microwave radiated by the microwave oven is high, and the bridge portion is heated excessively, the bridge portion separates the connection between the islands, and generates the island portion individually.
机译:要解决的问题:提供一种微波炉加热包装主体,其具有导电发热层,其在无论微波辐射的输出状态和密封在其中的食物材料的加热方法如何产生所需状态的导电发热层。一种包装体( 100)对于微波炉加热包括第一片构件(1)。除了基板层(12)和密封剂层(13)之外,在第一片构件(1)上形成导电发热层(14)。导电加热层(14)设置有多个岛,包括由有机化合物制成的导电材料,以及包括导电材料并连接相邻岛部分的桥接部分。微波炉加热,导电发热层( 14)产生热量,从而减小与该部分(蒸汽出口(5)的出口)相邻的密封剂层(13)的一部分以形成蒸汽出口。微波RADI的输出状态通过微波炉炉处高,并且桥接部分过度加热,桥接部分将岛屿之间的连接分开,并单独产生岛部分。

著录项

  • 公开/公告号JPWO2020240920A1

    专利类型

  • 公开/公告日2021-09-13

    原文格式PDF

  • 申请/专利权人 株式会社熊谷;

    申请/专利号JP20200516917

  • 发明设计人 熊谷 正巳;内藤 新吾;荒木 雅也;

    申请日2020-01-29

  • 分类号B65D81/34;

  • 国家 JP

  • 入库时间 2024-06-14 22:03:19

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