MEMS Wafer level packaging method with solderball for MEMS device

摘要

A method for packaging a MEMS device wafer using a solder ball is provided. A wafer level packaging method using a solder ball of the present invention includes the steps of: providing a MEMS device wafer having a MEMS structure formed on one surface and a sacrificial layer and a wetting layer formed around the MEMS structure; removing the sacrificial layer; forming solder balls at predetermined intervals along the wetting layer; and placing a cap wafer on the MEMS wafer on which the solder balls are formed, and bonding the MEMS device wafer and the cap wafer by pressing.