WAFER TO WAFER BONDING APPARATUS, WAFER TO WAFER BONDING SYSTEM, AND WAFER TO WAFER BONDING METHOD

摘要

The wafer bonding apparatus has a first surface and includes a lower stage for adsorbing a first wafer disposed on the first surface, a second surface facing the first surface, and a second surface disposed on the second surface. 2 An upper stage for adsorbing a wafer, an upper push rod for lifting and lowering through a central hole formed in the central region of the upper stage to press the central region of the second wafer, and a second surface of the upper stage And a heat generating device including a plurality of heat generating elements for heating the second wafer, and independently controlling the calorific values of the heat generating elements so that the temperature distribution of the second wafer has different distributions in an azimuth direction with respect to the center. Includes.