Polishing liquid composition for silicon wafer or polishing liquid composition kit for silicon wafer

摘要

To provide a composition for a silicon wafer polishing liquid and a composition kit for a silicon wafer polishing liquid, capable of stably reducing surface roughness (haze) and surface defect (LPD) on a polished silicon wafer surface.SOLUTION: A composition for a silicon wafer polishing liquid of the present invention is obtained by mixing a silica particle dispersion containing a silica particle, a basic compound and an aqueous medium and an additive solution containing a water-soluble polymer compound and an aqueous medium. The silica particle dispersion is obtained by keeping a mixed liquid with a pH at 25°C of 9 or more and 11 or less for one day or more at 10°C or above and 80°C or below, the mixed liquid being obtained by mixing the silica particle, the basic compound and the aqueous medium, or the silica particle dispersion has a transmittance of light with a wavelength of 600 nm of 5.0% or more and 30% or less in one of cases where the content of the silica particle thereof is 5 mass% or more and 20 mass% or less.SELECTED DRAWING: None