A SEMICONDUCTOR INTEGRATED CIRCUIT CHIP STRUCTURE PROTECTED AGAINST IMPACT DAMAGE FROM OTHER CHIPS DURING CHIP HANDLING

• 1. 一种防止冲击压损坏的风冷却器芯片结构 [P] . 中国专利： CN207515586U . 2018.06.19
• 2. 芯片分离过程中避免损坏的半导体晶片保护结构 [P] . 中国专利： CN100470798C . 2009.03.18
• 3. A SEMICONDUCTOR INTEGRATED CIRCUIT CHIP STRUCTURE PROTECTED AGAINST IMPACT DAMAGE FROM OTHER CHIPS DURING CHIP HANDLING [P] . 法国专利： FR2158230B1 . 1979-02-09

  机译： 防止芯片在处理过程中受到其他芯片的冲击损坏的半导体集成电路芯片结构

• 4. A SEMICONDUCTOR INTEGRATED CIRCUIT CHIP STRUCTURE PROTECTED AGAINST IMPACT DAMAGE FROM OTHER CHIPS DURING CHIP HANDLING [P] . 日本专利： JPS5237913B2 . 1977-09-26

  机译： 防止芯片在处理过程中受到其他芯片冲击损坏的半导体集成电路芯片结构的保护

• 5. A SEMICONDUCTOR INTEGRATED CIRCUIT CHIP STRUCTURE PROTECTED AGAINST IMPACT DAMAGE FROM OTHER CHIPS DURING CHIP HANDLING [P] . 日本专利： JPS4858773A . 1973-08-17

  机译： 防止芯片在处理过程中受到其他芯片的冲击损坏的半导体集成电路芯片结构

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• 5. Recent progress of integrated circuits and optoelectronic chips [O] . Yue Hao, Shuiying Xiang, Genquan Han, 2021

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