DEVICE PROVIDED WITH A PUNCHER AND A DRIPPER FOR THE HERMETIC SEALING OF CONTAINERS

• 1. 纸容器内密封带、纸容器内纵向密封带及带有纵向密封带的纸容器 [P] . 中国专利： CN1852838A . 2006-10-25
• 2. 密封膜制造方法及制造装置、带有内侧密封材容器的制造方法、内侧密封材及使用该内侧密封材的带盖容器的密封方法 [P] . 中国专利： CN101652293A . 2010-02-17
• 3. Device, provided with a puncher and a dripper, for the hermetic sealing of containers [P] . 美国专利： US3968872A . 1976-07-13

  机译： 带有打孔器和滴头的装置，用于容器的气密性密封

• 4. Device, provided with a puncher and a dripper, for the hermetic sealing of containers [P] . ES428893A1 . 1976-08-16

  机译： 带有打孔器和滴头的装置，用于容器的气密性密封

• 5. Hermetic sealing device for containers, of the type comprising a lid that fits in the mouth of the container provided with a tear-off seal (Machine-translation by Google Translate, not legally binding) [P] . ES182990U . 1973-06-16

  机译： 用于容器的气密性密封装置，其类型包括盖，该盖装配在具有可撕开密封的容器口中（由Google Translate进行机器翻译，无法律约束力）

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• 2. Design and Implementation of Automatic Control Drip Irrigation Device in Macadamia Digital Management [J] . Bo YANG, Liming TANG, Zheng FU, 气象与环境研究：英文版 . 2021,第006期
• 3. A wireless-communication-based measurement of gas pressure with capsule-slime sealing device [J] . Zhengyan Wu, Deqiang Fan, Shuguang Jiang, 矿业科学技术（英文版） . 2019,第006期
• 4. A wireless-communication-based measurement of gas pressure with capsule-slime sealing device [J] . Zhengyan Wu, Deqiang Fan, Shuguang Jiang, 矿业科学技术学报：英文版 . 2019,第006期
• 5. Laser Beam Welding of Aluminium: Process Optimisation to achieve hermetic sealing for Electrochemical energy system containers [C] . T.D Mercy, Rahul Sharma, V.F.Kaladharan, Advances in metallic materials and manufacturing processes for strategic sectors . 2012
• 6. A Study of Micro-Mechanical Punching for the Interconnection of Polymer Microfluidic Devices [D] . Lek, Devanda Rex. 2018
• 7. Grain size and grain depth restrict oxygen movement in leaky hermetic containers and contribute to protective effect [O] . Scott B. Williams, Larry L. Murdock, Kabita Kharel, -1
• 8. Breakdown Voltage for Superjunction Power Devices With Charge Imbalance: An Analytical Model Valid for Both Punch Through and Non Punch Through Devices [O] . Han Wang, Ettore Napoli, Florin Udrea 2009
• 9. HERMETIC SEALING OF PROPELLANT CONTAINERS BY PRESSURE WELDING [R] . CHARLES ZGLENICKI LOUIS SILBERMAN 1964

• 1. Measurement　of　Moisture　Inside　the　Hermetic　Package　of　Semiconductor　Device [J] . XIEXuqiang ,YUTieyan . 半导体光子学与技术：英文版 . 1996,第4期
• 2. 气密封非固体电解质钽电容器密封结构的改进 [C] . 王春玲 ,张蕾 ,王雪 . 第七届国防科技工业生产制造工艺技术创新研讨会 . 2013
• 3. 大流量补偿式滴头检测设备的研究与开发 [A] . 陈耀春 . 2006