Soldering system which prevents excess solder at contact - is used in solder bath dipping processes and involves use of tinned and etched aluminium pins

摘要

The contacting system allows contact pins to be attached to a PCB by bath or dip soldering. It operates without increasing the thickness of the contact region of the pin and without solder collecting in this region. The pins are made of a metal such as aluminum that rapidly oxidises unless protected by a suitable coating. The entire surface of each contact pin is electrolytically coated with a metal such as tin and then that part of the surface that will later come into contact with the socket is etched away. When the PCB with the pins inserted is dipped into the solder bath, solder only adheres to the treated surface and not to the etched surface.