Wiring board contact pins soldering method for electronic device, involves irradiating laser light on solder balls on electrode pads to form fillets between pads and pedestals for soldering contact pins

摘要

Pedestals (10c) for soldering contact pins and solder balls on the electrode pads of a wiring board, are arranged in close proximity. The solder balls are melted by irradiating laser light and fillets are formed between the electrode pads and pedestals, for fixing the pedestals to the pads. An Independent claim is included for contact pins.