System for lift-dip soldering of the components, comprises a first zone, in which a protective gas is introduced and the solder baths and scooping tools are present, and a unit for forming a second zone for the components to be soldered

摘要

The lift-dip soldering system comprises a first zone (5), in which a protective gas is introduced and the solder baths and scooping tools (3) are present, and a unit for forming a second zone (14) for components (10a, 10b, 10c, 10d, 10e) to be soldered, where the second zone is flushable with the protective gas and the first and second zones are connected to a third zone (16) for soldering the components. A movable cover (4) is present between the first zone and the unit, and is horizontally moved away to connect the first and second zones to the third zone. The lift-dip soldering system comprises a first zone (5), in which a protective gas is introduced and the solder baths and scooping tools (3) are present, and a unit for forming a second zone (14) for components (10a, 10b, 10c, 10d, 10e) to be soldered, where the second zone is flushable with the protective gas and the first and second zones are connected to a third zone (16) for soldering the components. A movable cover (4) is present between the first zone and the unit, is horizontally moved away to connect the first and second zones to the third zone, and is present above a working level of the scooping tools. The unit for the formation of the second zone comprises an upper tool, the cover, an edge of the cover and/or an edge of a container for receiving the solder. The second zone is formed by a procedure of the upper tool in direction of the cover to an end with the edge, which surrounds the cover. The upper tool includes the components to be soldered. The first zone is flushable with the protective gas. The protective gas is nitrogen, argon or forming gas. The third zone comprises protective gas in an entire area between the components to be soldered. An independent claim is included for a method for lift-dip soldering.