首页> 外国专利> Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leads

Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leads

机译:印刷电路板组件,将组件的端子固定到板上-在绝缘层上钻孔,该绝缘层由直径较小的导电层密封。比元件引线

摘要

The printed circuit board assembly system incorporates an improved method of fixing the terminal wires of the electronic components onto the board. The panel phenomena in the soldered section of the component wires is avoided. This method achieves more compact wiring and improves component density. The conducting area on the printed circuit board is not drilled. There are preset holes (4) which are formed by drilling through the insulating layer (12) so that one end of the holes concerned (14) will be sealed off by the conducting layer. The dia. of the hole is smaller than that of the component leads.
机译:印刷电路板组装系统结合了将电子部件的端子线固定到板上的改进方法。避免了在组件线的焊接部分出现面板现象。此方法可实现更紧凑的布线并提高组件密度。印刷电路板上的导电区域未钻孔。通过在绝缘层(12)上钻孔而形成预定的孔(4),使得所涉及的孔(14)的一端将被导电层密封。直径孔的直径小于元件引线的直径。

著录项

  • 公开/公告号FR2417236A1

    专利类型

  • 公开/公告日1979-09-07

    原文格式PDF

  • 申请/专利权人 CHUO MEIBAN MFG CO LTD;

    申请/专利号FR19790003065

  • 发明设计人

    申请日1979-02-07

  • 分类号H05K13/02;H05K1/18;

  • 国家 FR

  • 入库时间 2022-08-22 19:30:54

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