Development of Nondestructive Testing Techniques for Plated-Through Holes in Multilayer Printed Circuit Boards

摘要

The development of a nondestructive test with the capability to interrogate plated-through holes as small as 0.51 millimeters inside diameter is discussed. The system can detect defects such as holes, voids, cracks, and thin spots that reduce the current carrying capability of plates-through interconnects by 20 percent or more. Efforts were directed toward the design and fabrication of magnetic circuitry mutual coupling probes and to evaluate the effectiveness of these devices for detecting in multilayer board plated-through holes. (Author)