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Blind Via Hole in Multi-layer AFRP Printed Wiring Boards by Build Up Process. Quality of Drilled Hole by Small Power Laser.

机译：通过构建过程，多层AFRP印花布线板盲通孔。小功率激光钻孔质量。

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Toshiki HIROGAKI; Heisaburo NAKAGAWA; Eiichi AOYAMA; Tsutao KATAYAMA; Hisahiro INOUE;
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年度 2000
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1. Blind via hole drilling for multi-layers printed wiring board using laser beam -comparison between aramid and glass fiber reinforced PWB- [J] . Toshiki Hirogaki, Eiichi Aoyama, Hisahiro Inoue, 材料 . 1999,第5期

机译：用于多层印刷配线板的盲通孔钻孔使用激光束 - 芳纶和玻璃纤维之间的比较加强PWB-
2. Blind via hole drilling for multi-layers printed wiring board using laser beam -comparison between aramid and glass fiber reinforced PWB- [J] . Toshiki Hirogaki, Eiichi Aoyama, Hisahiro Inoue, 材料 . 1999,第5期

机译：使用激光束对多层印刷线路板进行盲孔打孔-芳纶与玻璃纤维增强PWB之间的比较-
3. Pulse Laser Irradiation Control Method for Blind Via-Hole Drilling of Printed Wiring Boards Based on High-Speed Camera Monitoring [J] . Koji Kanki, Munetaka lozumi, Toshiki HIROGAKI, Materials science forum . 2016,第期

机译：基于高速摄像头监控的印刷线路板盲孔盲打脉冲激光辐照控制方法
4. Drilled hole quality in laser machining of AFRP for printed wiring board (temperature of hole wall and thermal damage in drilling) [C] . Hisaya Kondou, Shinji Maeda, Toshiki Hirogaki, FRPシンポジウム . 2000

机译：用于印刷线路板的激光加工激光加工钻孔质量（孔墙温度和钻孔热损坏）
5. Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards. [D] . Fu, Chia-Yu. 1999

机译：内部状态变量模型在印刷线路板的热加工和电镀通孔的可靠性中的应用。
6. Analyzing the Effects of the Kinematic System on the Quality of Holes Drilled in 42CrMo4 + QT Steel [O] . Mateusz Bronis, Edward Miko, Lukasz Nowakowski 2021

机译：运动系统对42Crmo4 + QT钢钻孔质量的影响
7. Estimation of monitoring image in laser blind via-hole drilling process of printed wiring boards with a high speed video camera and temperature visualization from obtained image by two-color method [O] . Toshiki HIROGAKI, Eiichi AOYAMA, Kouji KANKI, 2019

机译：用高速摄像机的印刷线路电路板激光盲通孔钻井过程中监测图像的估计，用双色方法从获得的图像温度可视化
8. Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1. Design for the Environment Printed Wiring Board Project. [R] . Kincaid, L. E., Geibig, J. R. 1998

机译：印刷线路板清洁技术替代品评估：制作孔导电，第1卷。环境印刷线路板项目设计。

Blind Via Hole in Multi-layer AFRP Printed Wiring Boards by Build Up Process. Quality of Drilled Hole by Small Power Laser.

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