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Method and apparatus for measuring the thickness of thin layers by x ray fluorescence

机译:通过x射线荧光测量薄层厚度的方法和设备

摘要

P the invention relates to the measurement of the thicknesses of the thin layers of the sample. / p & & p & it relates to a method and apparatus for measurement of thin layers deposited on one another on a substrate, simultaneously, and by x-ray fluorescence. the incident x-rays excite the fluorescence of the sample, and this is detected by means of a collimator which also allows a direct control of the intensity of the incident x-rays. Application to the measurement simultaneous of the thicknesses of several layers of the electronic circuit. / p
机译:本发明涉及样品薄层厚度的测量。 & &本发明涉及一种同时通过X射线荧光测量彼此沉积在基板上的薄层的方法和设备。入射的X射线激发样品的荧光,并通过准直仪进行检测,该准直仪还可以直接控制入射的X射线的强度。同时应用于电子电路多层厚度的测量。

著录项

  • 公开/公告号FR2393266B1

    专利类型

  • 公开/公告日1982-03-19

    原文格式PDF

  • 申请/专利权人 WESTERN ELECTRIC CY INC;

    申请/专利号FR19770015153

  • 发明设计人

    申请日1977-05-17

  • 分类号G01B15/02;H01L21/66;

  • 国家 FR

  • 入库时间 2022-08-22 12:31:36

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