首页>
外国专利>
Removal of copper contamination from tin plating baths
Removal of copper contamination from tin plating baths
展开▼
机译:去除镀锡槽中的铜污染
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for removing copper contaminants from acid electroplating baths comprising adding to the bath sodium formaldehyde sulfoxylate. The presence of the sodium formaldehyde sulfoxylate overcomes overall plating haze and low current density dullness due to copper contamination in the acid tin bath.
展开▼