首页> 外国专利> Additive for electrolytic copper plating bath, electrolytic copper plating bath containing the additive and electrolytic copper plating method using the electrolytic copper plating bath

Additive for electrolytic copper plating bath, electrolytic copper plating bath containing the additive and electrolytic copper plating method using the electrolytic copper plating bath

机译:用于电解铜镀浴的添加剂,包含该添加剂的电解铜镀浴以及使用该电解铜镀浴的电解铜镀方法

摘要

Conventionally, when copper is embedded in a trench of a substrate to be plated having fine trenches or holes (hereinafter may be abbreviated as trenches) by electrolytic copper plating, generation of voids and precipitation of copper other than trenches are problematic It was getting. In order to solve the above-mentioned problems, the present invention provides a method for producing a thermoplastic elastomer composition comprising at least one polymer selected from the group consisting of the following general formula (1) and the following general formula (2) An additive for an electrolytic copper plating bath comprising a polymer compound having a molecular weight is provided. (In the formula, X represents at least one unit selected from units represented by a specific structure, and the ratio of a and b is within the range of a: b = 10: 90 to 99: 1.)
机译:传统上,当通过电解镀铜将铜埋入具有细沟槽或孔的被镀基板的沟槽中(以下有时简称为沟槽)时,除了沟槽之外,空隙的产生和铜的析出是有问题的。为了解决上述问题,本发明提供了一种用于制造热塑性弹性体组合物的方法,所述热塑性弹性体组合物包含选自由以下通式(1)和以下通式(2)组成的组中的至少一种聚合物。本发明提供一种用于电解镀铜浴的电解槽,其包含具有分子量的高分子化合物。 (式中,X表示选自由特定结构表示的单元中的至少一个单元,a与b之比在a∶b = 10∶90〜99∶1的范围内。)

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