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METHOD FOR ELECTROPLATING ON INSIDE SURFACE OF PIPE

机译:在管道内表面电镀的方法

摘要

PURPOSE:To form easily a pinhole-free plating layer having a uniform thickness in the stage of electroplating Ni and Cu, etc. on the inside surface of a steel pipe by disposing anodes in the central part of the steel pipe, rotating the steel pipe and performing plating while circulating the plating liquid in the steel pipe. CONSTITUTION:Anodes 7 are attached correctly to the longitudinally central part of a steel pipe 4 by using many non-conductive spacers 5 in the stage of forming a plating layer of a metal such as Ni, Cu or the like on the inside surface of the pipe 4 by electroplating. The pipe 4 is rotated around the anodes 7 on a driving roller 8 and guide rollers 9. At the same instant, a plating liquid is circulated through a plating liquid pool 1, a filter 2, a swivel joint 6, the pipe 4 and the joint 6. Electricity is conducted to the anodes 7 and the pipe 4 as a cathode while the spacers operated by a handle 12 move back and forth the anodes 7 in the longitudinal direction of the steel pipe, by which the pinhole- free plating layer having a uniform thickness is formed.
机译:用途:在钢管的内表面上电镀阳极,旋转钢管,以便在钢管的内表面上电镀镍,铜等的过程中容易形成厚度均匀的无针孔镀层。在使电镀液在钢管内循环的同时进行电镀。组成:在钢管4的内表面上形成诸如Ni,Cu等金属的镀层的阶段,通过使用许多不导电的垫片5将阳极7正确地连接到钢管4的纵向中心部分。管4通过电镀。管4绕着驱动辊8和导向辊9上的阳极7旋转。同时,电镀液循环流过电镀液池1,过滤器2,旋转接头6,管4和金属管。接头6将电流传导至作为阴极的阳极7和管4,同时由手柄12操作的间隔件在钢管的纵向方向上来回移动阳极7,由此无针孔镀层具有形成均匀的厚度。

著录项

  • 公开/公告号JPS6024396A

    专利类型

  • 公开/公告日1985-02-07

    原文格式PDF

  • 申请/专利权人 MITSUBISHI JUKOGYO KK;

    申请/专利号JP19830130173

  • 发明设计人 MURAKAMI MASAHARU;

    申请日1983-07-19

  • 分类号C25D7/04;

  • 国家 JP

  • 入库时间 2022-08-22 08:28:34

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