首页> 外国专利> Pre-alloyed thick film conductor for use with aluminum wire bonding and method of bonding

Pre-alloyed thick film conductor for use with aluminum wire bonding and method of bonding

机译:用于铝线键合的预合金厚膜导体及其键合方法

摘要

A thick film conductor material comprising metal particles containing both gold and at least one additional element prealloyed into a single particle. The additional element may preferably be Pd and the prealloying may preferably be accomplished by coprecipitation. The conductor material, when bonded with Al wire, impedes the growth of intermetallic compounds and subsequent Kirkendall voids, even at elevated temperatures.
机译:一种厚膜导体材料,包括金属颗粒,该金属颗粒既包含金,又包含预合金成单个颗粒的至少一种其他元素。所述附加元素可优选为Pd,并且所述预合金可优选通过共沉淀来实现。当导体材料与铝线粘合时,即使在高温下,也阻止了金属间化合物和随后的肯肯德尔空隙的生长。

著录项

  • 公开/公告号US4517252A

    专利类型

  • 公开/公告日1985-05-14

    原文格式PDF

  • 申请/专利权人 THE BOEING COMPANY;

    申请/专利号US19830492512

  • 发明设计人 STEVEN C. HUGH;

    申请日1983-05-06

  • 分类号H01B1/02;B22F7/04;B32B15/02;

  • 国家 US

  • 入库时间 2022-08-22 07:52:37

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号