base material for the production of printed circuits and process for its preparation

摘要

A base material for use in the production of a printed circuit is disclosed which exhibits improved adhesion between the carrier sheet or sheets thereof and the core sheets thereof and which allows improved bonding between metal deposited thereon electrolessly subsequently for use in the formation of the printed circuit and the carrier sheet or sheets. This desirable character is achieved by modifying the conventional practice of impregnating the carrier sheet(s) with a resin solution prior to application of a rubber-based adhesive thereto to include a second impregnation step in which impregnation is effected using a mixture of a self-curing acrylic resin and a phenol-resol resin and then drying the second impregnating composition prior to applying the rubber-based adhesive composition.