METHOD OF LASER ANNEALING A SUBSURFACE REGION IN A SEMICONDUCTOR

摘要

A method for annealing ion implanted regions buried in a semiconductor substrate without the undesirable effects of thermal diffusion which includes the radiation of the substrate by a continuous laser having an emission frequency longer than 600 nanometers which the buried ion implanted regions will absorb strongly but which will be substantially unabsorbed by the unimplanted regions. Superior results can be obtained when the substrate is heated to approximately 300 DEG during this laser annealing.