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Process for deposition of metals as a thin layer on a nonmetallic substrate, with intermediate deposition of hydrides by reactive cathodic sputtering

机译:在非金属基板上沉积金属薄层的方法,通过反应性阴极溅射进行氢化物的中间沉积

摘要

Process for deposition of metals as a thin layer of high adherence on a nonmetallic substrate, by intermediate deposition of a layer of hydrides, characterised in that a layer of hydrides of the metals forming the target is deposited temporarily by reactive cathodic sputtering, the said target consisting of titanium or of a mixture or alloy based on titanium and on at least one other metal chosen from vanadium, chromium, manganese, iron, cobalt, nickel, copper, zirconium, niobium, molybdenum, hafnium, tantalum, tungsten, the rare earths and platinum; application especially to the production of ceramic-metal welds.
机译:通过在氢化物层之间进行中间沉积而在非金属基底上沉积金属作为高附着力薄层的方法,其特征在于,形成靶的金属的氢化物层通过反应性阴极溅射临时沉积,所述靶由钛或基于钛的混合物或合金以及至少一种选自钒,铬,锰,铁,钴,镍,铜,锆,铌,钼,ha,钽,钨,钨,稀土的混合物或合金组成和铂;特别是在陶瓷金属焊缝生产中的应用。

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