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Composition/bandgap selective dry photochemical etching of semiconductor materials

机译:半导体材料的成分/带隙选择性干光化学刻蚀

摘要

A method of selectively photochemically dry etching a first semiconductor material of a given composition and direct bandgap Eg.sub.1 in the presence of a second semiconductor material of a different composition and direct bandgap Eg.sub.2, wherein Eg.sub.2 Eg.sub.1, said second semiconductor material substantially not being etched during said method, comprises subjecting both materials to the same photon flux and to the same gaseous etchant under conditions where said etchant would be ineffective for chemical etching of either material were the photons not present, said photons being of an energy greater than Eg.sub.1 but less than Eg.sub.2, whereby said first semiconductor material is photochemically etched and said second material is substantially not etched.
机译:一种在具有不同组成和直接带隙例如2的第二半导体材料的存在下,选择性地光化学干法刻蚀给定成分和直接带隙Eg.1的第一半导体材料的方法,其中Eg.2 >例如,在所述方法期间基本上不蚀刻所述第二半导体材料的步骤,包括在所述蚀刻剂对所述两种材料中的任何一种进行化学蚀刻均无效的条件下,使两种材料经受相同的光子通量和相同的气态蚀刻剂。光子不存在,所述光子具有大于例如Eg但小于例如Eg2的能量,由此所述第一半导体材料被光化学蚀刻并且所述第二材料基本上未被蚀刻。

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