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Process for improving the quality of epitaxial silicon films grown on insulating substrates utilizing oxygen ion conductor substrates

机译:利用氧离子导体衬底提高在绝缘衬底上生长的外延硅膜质量的方法

摘要

The present invention accomplishes the thermal oxidation of the silicon side of the interface present in epitaxial silicon films grown on yttria-stabilized cubic zirconia, Si / YSZ , to form a dual-layer structure of Si /amorphous SiO.sub.2 / YSZ . The SiO.sub.2 films are formed in either dry oxygen (at 1100. degree. C. ) or in pyrogenic steam (at 925 C.) by the rapid diffusion of oxidizing species through a 425 m thick cubic zirconia substrate. For instance, a 0.17 m thick SiO.sub.2 layer is obtained after 100 min in pyrogenic steam at 925 C. This relatively easy transport of oxidants is unique to YSZ and other insulators which are also superionic oxygen conductors, and cannot be achieved in other existing Si/insulator systems, such as silicon-on-sapphire.
机译:本发明完成了在氧化钇稳定的立方氧化锆 / 上生长的外延硅膜中存在的界面的硅侧的热氧化,以形成 /非晶SiO的双层结构。子2 / 。 SiO 2膜是通过在425 m厚的立方氧化锆衬底上快速扩散氧化物质而在干氧气(1100℃)或热蒸汽(925℃)中形成的。例如,在925 C的热蒸汽中100分钟后,获得了0.17 m厚的SiO2层。这种相对容易运输的氧化剂是YSZ和其他也是超离子氧导体的绝缘体所独有的,无法在其他现有的硅/绝缘体系统,例如蓝宝石硅。

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