首页>
外国专利>
Process for depositing small amounts of droplet-shaped solder on surfaces to be welted, and process for carrying out the process
Process for depositing small amounts of droplet-shaped solder on surfaces to be welted, and process for carrying out the process
展开▼
机译:在要焊接的表面上沉积少量液滴状焊料的方法以及进行该方法的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
In a method of applying small quantities of melted solder from a nozzle to surfaces to be wetted, which are then solidified, the solder is caused to melt by heating and is propelled by means of a piezoelectric transducer used as a pressure generator from a delivery nozzle in the form of droplets onto the area to be wetted.
展开▼