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Device for depositing amounts of droplet-shaped solder on surfaces to be wetted
Device for depositing amounts of droplet-shaped solder on surfaces to be wetted
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机译:在待润湿的表面上沉积大量液滴状焊料的装置
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摘要
In a method for applying small droplet-shaped quantities of solder to surfaces to be wetted, which are then soldered by remelting, it is provided that the solder is melted by heating and spun drop by drop from a dispensing nozzle onto the point to be wetted.
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