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Process for applying small amounts of molten, drop-shaped solder from a nozzle to surfaces to be wetted and device for carrying out the process
Process for applying small amounts of molten, drop-shaped solder from a nozzle to surfaces to be wetted and device for carrying out the process
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机译:从喷嘴向待润湿的表面施加少量熔融,滴状焊料的方法和实施该方法的装置
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摘要
In a method of applying small quantities of melted solder from a nozzle to surfaces to be wetted, which are then solidified, the solder is caused to melt by heating and is propelled by means of a piezoelectric transducer used as a pressure generator from a delivery nozzle in the form of droplets onto the area to be wetted.
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