Method for soldering printed circuits uses a heatable solder pot for solder to be processed and a nozzle device with a nozzle on a solder shaft for applying the solder onto a soldering point

摘要

A device uses a heatable solder pot (2) for solder (5) to be processed. A nozzle device (11) has a nozzle on a solder shaft that serves to apply the solder onto a soldering point (29). The melted-on solder and the solder material (16) are used in the most oxygen-enriched atmosphere possible. The solder shaft and the free end of one nozzle on the nozzle device for soldering move through a previously closed through-aperture in a masking element for the solder pot. An Independent claim is also included for a device for soldering printed circuits.