Solder pump, useful in a plant for soldering workpieces e.g. printed circuit boards or ceramic substrates, comprises solder nozzles, where one of the solder nozzles is designed as nozzle plate that comprises managing nozzles

摘要

The solder pump (1) comprises solder nozzles (2, 3), where one of the solder nozzles is designed as nozzle plate. The nozzle plate comprises managing nozzles that are arranged in series and columns and run vertically or diagonally to their surface so that suctions of the nozzles are arranged in spacing to the surface of the nozzle plate.