Device for depositing amounts of droplet-shaped solder on surfaces to be wetted

摘要

In a method of applying small quantities of melted solder from a nozzle to surfaces to be wetted, which are then solidified, the solder is caused to melt by heating and is propelled by means of a piezoelectric transducer used as a pressure generator from a delivery nozzle in the form of droplets onto the area to be wetted.