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METHOD AND DEVICE FOR REFLOW TYPE SOLDERING AND METHOD AND DEVICE FOR CLEANING HEATING TIP FOR REFLOW TYPE SOLDERING

机译:回流焊的方法和装置以及清理回流焊的加热尖端的方法和装置

摘要

PURPOSE:To improve the quality of soldering and to shorten the time for soldering by parting a heating tip from a soldering part in accordance with the degree of the penetration of solder and further cleaning the surface thereof in accordance with the degree of contamination on the tip surface. CONSTITUTION:A welding head 1 disposed with the heating tip 2 is provided above the soldering part on a working table 6 and a displacement means 7 for displacing the tip 2 in a vertical direction is disposed. The position of the tip 2 is detected by a detector 902 when the tip 2 descends upon melting of the solder 3. Then, a displacement driving control means 8 drives a motor 702 to part the tip 2 from the solder 3 in accordance with the penetration amt. of the solder 3. Further, a tip cleaning means 14 cleans the tip 2 to get rid of the contaminations in accordance with the excess of the heating time. The overheating of the soldered part is prevented by parting of the tip 2 and since the tip 2 is maintained always in the clean state, the quality of soldering is improved and the required time is shortened.
机译:目的:通过根据焊料的渗透程度将加热头与焊接部分分开,并根据焊头上的污染程度进一步清洁其表面,从而提高焊接质量并缩短焊接时间表面。构成:在工作台6上的焊接部分上方,设有一个装有加热头2的焊头1,并设有用于在垂直方向上移动焊头2的位移装置7。当焊锡3熔化时,当焊锡2下降时,由检测器902检测焊锡2的位置。然后,位移驱动控制装置8驱动马达702使焊锡3从焊锡3中分离,从而将焊锡3从焊锡3中分离出来。 amt。此外,烙铁头清洁装置14根据加热时间的延长来清洁烙铁头2以除去污染物。通过将尖端2分开而防止了焊接部分的过热,并且由于尖端2总是保持在清洁状态,所以改善了焊接质量并且缩短了所需时间。

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