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METHOD AND DEVICE FOR REFLOW TYPE SOLDERING AND METHOD AND DEVICE FOR CLEANING HEATING TIP FOR REFLOW TYPE SOLDERING
METHOD AND DEVICE FOR REFLOW TYPE SOLDERING AND METHOD AND DEVICE FOR CLEANING HEATING TIP FOR REFLOW TYPE SOLDERING
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机译:回流焊的方法和装置以及清理回流焊的加热尖端的方法和装置
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摘要
PURPOSE:To improve the quality of soldering and to shorten the time for soldering by parting a heating tip from a soldering part in accordance with the degree of the penetration of solder and further cleaning the surface thereof in accordance with the degree of contamination on the tip surface. CONSTITUTION:A welding head 1 disposed with the heating tip 2 is provided above the soldering part on a working table 6 and a displacement means 7 for displacing the tip 2 in a vertical direction is disposed. The position of the tip 2 is detected by a detector 902 when the tip 2 descends upon melting of the solder 3. Then, a displacement driving control means 8 drives a motor 702 to part the tip 2 from the solder 3 in accordance with the penetration amt. of the solder 3. Further, a tip cleaning means 14 cleans the tip 2 to get rid of the contaminations in accordance with the excess of the heating time. The overheating of the soldered part is prevented by parting of the tip 2 and since the tip 2 is maintained always in the clean state, the quality of soldering is improved and the required time is shortened.
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