REFLOW SOLDERING DEVICE AND METHOD OF HEATING REFLOW SOLDERING DEVICE

摘要

PURPOSE:To enable the time ratio between a preheat part and a reflow part to be changed so that flexible temperature profile can be set optionally by heat-processing it while carrying it in the vertical direction with a board held horizontally. CONSTITUTION:In a preheat part, it has mechanisms 18-22, which carry plural board 1 which are arranged horizontally in the vertical direction by intermittent sending while keeping certain regular intervals, and between the preheat part and the reflow part, a horizontal carry mechanism 28, which shifts the board 1 at the uppermost part of the vertical carry part to the reflow part, is provided. Accordingly, the stop time (reflow time) at the reflow part can be set optionally within the stop time at the first stage of the board receiving part in the 22 for receiving plural sheets of boards arranged in the vertical carry part of the preheat part. Hereby, the ratio of preheating time in the preheating part to the reflow time in the reflow part can be changed flexibly.