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Process for making BiCMOS integrated circuit having a shallow trench bipolar transistor with vertical base contacts

机译:具有具有垂直基极接触的浅沟槽双极晶体管的BiCMOS集成电路的制造工艺

摘要

An improved bipolar transistor of a BiCMOS integrated circuit is fabricated by utilizing a shallow trench structure. The shallow trench defines an active base and a self-aligned emitter. The base resistance of the transistor is reduced because a vertical, rather than lateral, link base, which connects an extrinsic base to the active base, is formed. In addition, the overall area is reduced, which provides for a lower collector to base capacitance.
机译:通过利用浅沟槽结构来制造BiCMOS集成电路的改进的双极晶体管。浅沟槽定义了有源基极和自对准发射极。晶体管的基极电阻降低了,因为形成了将非本征基极连接到有源基极的垂直而不是横向的连接基极。另外,减小了总面积,这提供了较低的集电极至基极电容。

著录项

  • 公开/公告号US4902639A

    专利类型

  • 公开/公告日1990-02-20

    原文格式PDF

  • 申请/专利权人 MOTOROLA INC.;

    申请/专利号US19890388885

  • 发明设计人 JENNY M. FORD;

    申请日1989-08-03

  • 分类号H01L21/283;H01L;

  • 国家 US

  • 入库时间 2022-08-22 06:07:55

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