首页> 外国专利> Method of manufacturing a planar semiconductor device having a guard ring structure

Method of manufacturing a planar semiconductor device having a guard ring structure

机译:具有保护环结构的平面半导体器件的制造方法

摘要

A method of manufacturing a semiconductor device of the "planar" type comprising a highly doped substrate having a doping concentration c.sub.o and an epitaxial surface layer having a carrier concentration c c. sub.o, in which are formed a main pn junction having a depth x.sub.j and a structure of floating guard rings. According to the invention, this device also includes between the substrate and the epitaxial surface layer, a second epitaxial layer having a carrier concentration c' such that c.sub.o c' c. This permits the production of devices with different maximum operating voltages using the same configuration of guard rings.
机译:一种制造“平面”型半导体器件的方法,该方法包括具有掺杂浓度c 0的高掺杂衬底和具有载流子浓度c <c的外延表面层。 sub.o,其中形成具有深度xj和浮动保护环结构的主pn结。根据本发明,该器件还包括在衬底和外延表面层之间的第二外延层,其载流子浓度为c′,使得c 0> c′> c。这允许使用相同配置的保护环生产具有不同最大工作电压的设备。

著录项

  • 公开/公告号US5028548A

    专利类型

  • 公开/公告日1991-07-02

    原文格式PDF

  • 申请/专利权人 U.S. PHILIPS CORP.;

    申请/专利号US19900544809

  • 发明设计人 MINH-CHAU NGUYEN;

    申请日1990-06-26

  • 分类号H01L21/04;

  • 国家 US

  • 入库时间 2022-08-22 05:46:17

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号