LEAD FRAME INSERT METHOD CIRCUIT-ATTACHED MOLDED PRODUCT

摘要

PURPOSE:To prevent deformation of the suspended leads of a lead frame when insert molding a lead frame for circuit formation by placing a channel or protrusion on the tip of the suspended lead control pin. CONSTITUTION:Metal is used for the lead frame material that forms a conduction circuit. When the lead frame is placed in a mold die, the suspended lead 4 is held fast by means of the frame control pin 6 which has a channel on its tip and the receiving pin 6' or by the frame control pin 7 which has a protrusion on its tip and the receiving pin 7' which has a hole on its tip. Then, the lead frame placed in the die is covered with a resin and mold formed.