首页> 外国专利> Device for encasing electronic components consisting of a lower and an upper casing part, which enclose a printed circuit board and are filled with electrical cladding material which encases the printed circuit board

Device for encasing electronic components consisting of a lower and an upper casing part, which enclose a printed circuit board and are filled with electrical cladding material which encases the printed circuit board

机译:用于封装由下部外壳部分和上部外壳部分组成的电子组件的装置,该下部外壳部分和上部外壳部分包围印刷电路板,并填充有电气覆层材料,该覆层材料包裹了印刷电路板

摘要

Device for encasing electronic components consisting of a plate casing 1, 2 filled with cladding material 5 and with the extension piece 14 also filled with the same material 5 and with the cladding material 5 being compressed in elastic deformation in the extension piece 14. A seal in the extension piece 14 is thereby ensured. IMAGE
机译:用于封装电子部件的设备,该设备包括装满覆层材料5的板壳1、2,延伸件14也填充有相同的材料5,并且覆层材料5在延伸件14中被弹性变形压缩。从而确保了在延伸件14中的位置。 <图像>

著录项

  • 公开/公告号SE466626B

    专利类型

  • 公开/公告日1992-03-09

    原文格式PDF

  • 申请/专利权人 KARL-ERIK LEEB;

    申请/专利号SE19890000181

  • 发明设计人 KARL-ERIK LEEB;

    申请日1989-01-19

  • 分类号H01L23/28;

  • 国家 SE

  • 入库时间 2022-08-22 05:33:58

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