Punching device for printed circuit board, has upper part and lower part, where component e.g. printed circuit board, that is to be punched is arranged between upper part and lower part, and sectional bushing is formed as sectional film

摘要

The device (10) has an upper part (12) that comprises a punching tool (13). A lower part (15) provided in the device comprises a retaining plate with a sectional bushing as a punching pattern, where a component e.g. printed circuit board, that is to be punched is arranged between the upper part and the lower part. The sectional bushing is formed as a sectional film (18) that is manufactured from plastic. An independent claim is also included for a punching method for manufacturing a ceramic film.