Connection procedure by laser of a conductor with a doped region of the substrate of an integrated circuit, and integrated circuit that implements the method.

摘要

DRIVER 15 TO UNITE doped region 12 OF substrate 11 has an edge 15A on which HEADS BEAM 20 REGULATED TO CREATE DEFINITELY A LOW ELECTRICAL RESISTANCE 19 in dielectric layer 13 zone separating the driver of the doped region . The invention applies ESPECIALLY TO LASER DAMAGED PROGRAMMING MEMORIES AND DEFECTIVE integrated circuits PURPOSE OF REPAIR.