ASSAY OF FLOW AMOUNT OF PROCESS GAS IN WAFER MANUFACTURING SYSTEM AND DEVICE AND METHOD FOR SAID ASSAY

摘要

The disclosure relates to a semi-conductor wafer processing system (10) which includes a reaction chamber (12) for containing a wafer (12W) to be processed, pump (14) for reducing pressure within the chamber during processing and a plurality of process flow controllers (16) for providing a constant flow of process reaction gas into the chamber. The flow of process gas used is verified against the known flow of a verification gas using a derivative of the ideal gas law: n'pro = (P'pro/P'ver) n'ver where n'pro is the flow rate of the process gas, n'ver is the flow rate of the verification gas, P'pro is the rate of change with respect to time of the process gas pressure entering the chamber, and P'ver is the rate of change with respect to time of the verification gas pressure entering the chamber. The volume and temperature are maintained constant during the verification procedure. IMAGE