首页> 外国专利> METHOD AND APPARATUS FOR DIVIDING SEMICONDUCTOR BAR INTO SEMICONDUCTOR DISKS HAVING ONE SURFACE WITH EXTREME FLATNESS AND SURFACE PROPERTIES AS GOOD AS POSSIBLE

METHOD AND APPARATUS FOR DIVIDING SEMICONDUCTOR BAR INTO SEMICONDUCTOR DISKS HAVING ONE SURFACE WITH EXTREME FLATNESS AND SURFACE PROPERTIES AS GOOD AS POSSIBLE

机译:将具有一个极平整度和尽可能好的表面特性的一个表面划分为半导电盘的方法和装置

摘要

PURPOSE: To provide a method and apparatus for dividing a semiconductor bar into semiconductor disks having one surface with extreme flatness and surface properties as good as possible. ;CONSTITUTION: A dresser 5 for roughing grinder 2 is operated so that the axial dislocation of the end faces of a finishing grinder 3 and the roughing grinder 2 is kept accurately in a predetermined value. And, a pot-form grinding tool consists of two mutually concentric pot-form grinders with metallic combining structure, where the outer electrolytic dressing grinder 3 containing fine particles has an electrolytic dresser 6 for forming workpiece surface as fine as possible, and the inner roughing grinder 2 containing coarse particles has an electrolytic dresser 5 for obtaining a predetermined axial dislocation of the end faces of both grinding tools.;COPYRIGHT: (C)1993,JPO
机译:目的:提供一种将半导体条分割成具有一个表面的半导体盘的方法和设备,该表面具有极好的平坦度和尽可能好的表面特性。 ;组成:粗磨机2的修整器5被操作,以使精磨机3和粗磨机2的端面的轴向错位精确地保持在预定值。并且,锅式研磨工具由两个具有金属结合结构的相互同心的锅式研磨机组成,其中包含细颗粒的外部电解修整研磨机3具有用于尽可能精细地形成工件表面的电解修整器6,以及内部粗加工含有粗颗粒的研磨机2具有电解修整器5,用于使两个研磨工具的端面实现预定的轴向错位。版权所有:(C)1993,JPO

著录项

  • 公开/公告号JPH05309645A

    专利类型

  • 公开/公告日1993-11-22

    原文格式PDF

  • 申请/专利权人 GMN GEORG MILLER NURNBERG AG;

    申请/专利号JP19920297463

  • 发明设计人 HINZEN HUBERT;

    申请日1992-11-06

  • 分类号B28D5/00;B24B7/22;B24B53/00;B28D1/22;H01L21/304;

  • 国家 JP

  • 入库时间 2022-08-22 04:48:53

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