Locking structure to prevent lead from falling out of the lead frame for semiconductor packaging

• 1. 一种防止烟支中烟丝掉出的装置 [P] . 中国专利： CN108378413A . 2018-08-10
• 2. 一种防止烟支中烟丝掉出的装置 [P] . 中国专利： CN208095997U . 2018.11.16
• 3. Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure [P] . 美国专利： US7459770B2 . 2008-12-02

  机译： 具有阻挡表面的引线框架结构和与该引线框架结构集成的半导体封装

• 4. HEAT BLOCK FOR MANUFACTURING A SEMICONDUCTOR PACKAGE, CAPABLE OF PREVENTING GENERATION OF FOREIGN MATERIALS DUE TO CONTACT FRICTION BETWEEN A LEAD FRAME LEAD AND A HEAT BLOCK [P] . 韩国专利： KR20090120604A . 2009-11-25

  机译： 用于制造半导体封装的热块，由于铅框架铅块和热块之间的摩擦而能够防止产生异物

• 5. LEAD FRAME STRUCTURE TO PREVENT BENDING OF SEMICONDUCTOR PACKAGE BODY [P] . 韩国专利： KR20000051981A . 2000-08-16

  机译： 引线框架结构可防止半导体封装体弯曲

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