HEAT BLOCK FOR MANUFACTURING A SEMICONDUCTOR PACKAGE, CAPABLE OF PREVENTING GENERATION OF FOREIGN MATERIALS DUE TO CONTACT FRICTION BETWEEN A LEAD FRAME LEAD AND A HEAT BLOCK

摘要

PURPOSE: A heat block for manufacturing a semiconductor package is provided to select a non metal material which can reduce a friction force in a part where a lead of a lead frame is mounted, thereby drastically reducing friction between the heat block and the lead during the second boding of capillary for the lead.;CONSTITUTION: A heat block for manufacturing a semiconductor package comprises the following features. The heat block is used during a process of bonding a wire(24) of a semiconductor package. The heat block is molded by a material inside the same metal group as a lead(16). A non metal material is used in a lead mounting surface of the heat block to reduce friction.;COPYRIGHT KIPO 2010