Semiconductor device for Chip On Board substrate and TAB substrate and lead frame - has rectangular chip-retaining support, with internal conductors on support surface round retaining surface formed in regular, rectangular arrangement

摘要

The semiconductor device includes a support (15) surface with a chip-retaining area (11). External conductors are formed in a coarse, dense pattern and conductive tracks (13) are formed on the support surface at end sections of corresp. external conductors. Internal conductors (12) are formed around the chip retaining area and are coupled to other end sections of the conductive tracks. The internal conductors are formed on the support surface round the retaining area regularly in a rectangular arrangement which is inclined at a preset angle (theta) w.r.t. each side of the support. The incline is such that the spacing between adjacent conductive tracks exceeds a preset value in each configuration. USE/ADVANTAGE - E.g. for microcomputer with large number of leads. Increased density for compact device.