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Low temperature sintering low dielectric inorganic composition

机译:低温烧结低介电无机组合物

摘要

A low temperature sintering, low dielectric inorganic composition is a ternary inorganic composition comprising cordierite, quartz glass and lead borosilicate glass, wherein if the amounts of the cordierite, quartz glass and lead borosilicate glass are represented by X, Y and Z (wt %) respectively, the composition of the ternary system falls within the range encircled by the following four points (a) to (d) including the lines between each neighboring two points:PP (X=35; Y=0; Z=65) (a)PP(X=65; Y=0; Z=35) (b)P P(X=0; Y=65; Z=35) (c)PP(X=0; Y=35; Z=65) (d)P P The inorganic composition has a dielectric constant substantially lower than that of the conventional composition while maintaining high reliability such as an ability of being sintered at a low temperature, high insulation properties and high resistance to water as well as excellent mechanical properties such as strength. The composition can be used for producing multilayer ceramic wiring boards for mounting very high speed VLSI elements and contributes to an increase in the packaging density and the production of fast transmitting devices.
机译:低温烧结低介电无机组合物是包含堇青石,石英玻璃和硼硅酸铅玻璃的三元无机组合物,其中堇青石,石英玻璃和硼硅酸铅玻璃的量由X,Y和Z表示(重量%)三元体系的组成分别落在以下四个点(a)至(d)所包围的范围内,包括相邻的两个点之间的线:

(X = 35; Y = 0; Z = 65)(a)

(X = 65; Y = 0; Z = 35)(b)

(X = 0; Y = 65; Z = 35)(c)

(X = 0; Y = 35; Z = 65)(d)

无机组合物的介电常数大大低于常规组合物的介电常数,同时保持了诸如具有在低温下烧结的能力,高绝缘性能和高耐水性以及出色的机械性能(例如强度)。该组合物可用于生产用于安装非常高速的VLSI元件的多层陶瓷布线板,并且有助于提高包装密度和生产快速传输装置。

著录项

  • 公开/公告号US5283210A

    专利类型

  • 公开/公告日1994-02-01

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;

    申请/专利号US19920905376

  • 发明设计人 YUZO SHIMADA;KEIICHIRO KATA;

    申请日1992-06-29

  • 分类号C03C14/00;C03C4/16;

  • 国家 US

  • 入库时间 2022-08-22 04:32:17

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