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Dielectric particle aggregate, low-temperature sintered dielectric ceramic composition using the same, and low-temperature sintered dielectric ceramic manufactured using the same
Dielectric particle aggregate, low-temperature sintered dielectric ceramic composition using the same, and low-temperature sintered dielectric ceramic manufactured using the same
A low temperature sinterable dielectric ceramic composition is obtained by bending 2.5-20 parts by weight of a glass component per 100 parts by weight of an aggregate of dielectric particles which are composed of Ti-containing dielectric material and contain an oxide including Ti and Zn in the surface portions. A low temperature sintered dielectric ceramic is produced by sintering this low temperature sinterable dielectric ceramic composition at 880 to 1000°C. With this low temperature sinterable dielectric ceramic composition, there can be obtained a multiplayer electronic component having an internal conductor composed of Ag, Cu or an alloy containing at least one of them.
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