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Method of manufacturing a semiconductor device with a heterojunction by implantation with carbon-halogen compound

机译:通过注入碳-卤素化合物来制造具有异质结的半导体器件的方法

摘要

A method of manufacturing a semiconductor device in which a surface zone (3) adjoining a surface (2) is formed in a silicon semiconductor body (1) by local application of carbon and dopant atoms, the carbon atoms being provided by means of implantation (4). Halogen atoms are provided simultaneously with the carbon atoms by means of an implantation with ions of a carbon-halogen compound, after which a heat treatment is carried out such that non-bonded halogen atoms are removed from the surface zone (3). Such a method is suitable for making a surface zone (3) which has a greater bandgap than silicon. The surface (3) is suitable, for example, for making an emitter region of a heterojunction bipolar transistor (HBT).
机译:一种制造半导体器件的方法,其中通过局部施加碳和掺杂原子在硅半导体主体(1)中形成与表面(2)邻接的表面区域(3),碳原子通过注入提供( 4)。通过注入碳-卤素化合物的离子,与碳原子同时提供卤素原子,此后进行热处理,以使未键合的卤素原子从表面区域(3)除去。这种方法适合于制造具有比硅更大的带隙的表面区域(3)。表面(3)适合于例如制造异质结双极晶体管(HBT)的发射极区。

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