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The mask structure for lithography and the photo lithography process manner null which uses

机译:用于光刻的掩模结构和光刻工艺方式无效

摘要

PURPOSE:To set an alignment and a gap with a material to be worked in high accuracy by providing a through hole which can pass an energy beam at a position corresponding to a scribing line of the material. CONSTITUTION:An electron beam is emitted from above to a pore 5 while moving a mask structure 13 relatively rightward or leftward to a semiconductor wafer 10 to detect secondary electrons generated from the wafer 10. In this case, the detected value of the electrons is different according to the presence or absence of an alignment mark, and the disposition of the pore 15 of the structure 13 when the detected value is maximum is in the state that the pore 15 of the structure 13 is disposed accurately to the scribing line 12 of the wafer. The relative positional relationship between the wafer 10 and the structure 13 can be set accurately by detecting a plurality of pores 5. The electron beam which has passed the pore 5 is measured in case of measuring a gap. Thus, an alignment and the gap can be set in high accuracy.
机译:目的:通过在与材料的划线相对应的位置上设置一个能使能量束通过的通孔,来与要高精度加工的材料设置对准和间隙。组成:电子束从上方发射到孔5,同时将掩模结构13相对向右或向左移动到半导体晶圆10,以检测由晶圆10产生的二次电子。在这种情况下,电子的检测值不同根据是否存在对准标记,并且当检测值最大时结构13的孔15的布置是在结构13的孔15被精确地布置到切割线12的划线12的状态下。硅片。通过检测多个细孔5,可以准确地设定晶片10与构造体13的相对位置关系。在测定间隙的情况下,对通过细孔5的电子束进行测定。因此,可以高精度地设置对准和间隙。

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