Printed two-layer or multilayer circuit, method for manufacturing a printed circuit board of this type and laminated to manufacture a printed circuit board of this type by this method.

摘要

A Printed Circuit Board Multilayer O BICAPA (1) comprises a support plate (2) consisting of a base material and carrying a conductive pattern first (3) AND PATRON CONDUCTOR SECOND CONNECTED TO SUPPORT PLATE (2) an adhesive layer (1) consisting of an electrically insulating adhesive material. AVAILABLE at least one opening (12,13) ​​in the adhesive layer (11), carrying opening a connection section (4.5) THE CONDUCTOR FIRST PATRON (3) and extending it to a connecting section (18 19) THE PATRON CONDUCTOR second (17) and through said opening connecting sections (4,5,18,19) CONDUCTOR PATTERNS (3,17) can be electrically connected THROUGH electrically connection CONDUCTOR (28,29). LA adhesive layer (11) comprises an adhesive material in a range SOME OF TEMPERATURE has greater hardness than the region (2A) of the plate (2) ATTACHED TO THE PATRON CONDUCTOR FIRST (3), AND THE PATRON CONDUCTOR FIRST (3) is pressed against the plate (2) through adhesive layer (11) exclusively in its region covered by the adhesive layer (11) AS A RESULT OF A PROCESS OF pRESSURE TO UNITE jointly adhesive layer (11) and the plate (2) WHILE EACH REGION connection section (4.5) CONDUCTOR OF FIRST PATRON (3) SURROUNDED BY AN OPENING (12,13) ​​is curved shape in the direction of a connecting section (18 19) SECOND CONDUCTOR PATTERN (17).