Semiconductor processing system and alignment method and apparatus for the transfer mechanism

摘要

The cleaning system of the semiconductor wafer has a chemical liquid cleaning section having a treatment vessel. A holder for holding 50 wafers at a time is provided in the treatment vessel. The holder is provided with 50 grooves for accommodating the periphery of the wafer. 50 wafers are collectively held with respect to the holder by a chuck having a pair of opening and closing arms. Each arm is provided with 50 grooves for accommodating the edge portions of the wafer. An imaging section is provided at both end portions to correct a deviation of a relative position between the chuck and the holder from a relative position reference for accepting the wafer. Each image pickup unit simultaneously picks up the groove of the chuck and the groove corresponding thereto. The picked up grooves are superimposed and displayed in the same coordinates on the monitor. The chuck and the holder are relatively moved to correct the deviation of the image of the captured two grooves, and the deviation of the developing belt position from the relative position reference is corrected.