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Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system

机译:响应面法在多层陶瓷电容器对准系统最优传递条件中的应用

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摘要

The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes.As a result of testing performance verification of MLCC alignment system,the average alignment rates are 95% for 3216 chip,88.5% for 2012 chip and 90.8% for 3818 chip.The MLCC alignment system can be accepted for practical use because the average manual alignment is just 80%.In other words,the developed MLCC alignment system has been upgraded to a great extent,compared with manual alignment.Based on the successfully developed MLCC alignment system,the optimal transfer conditions have been explored by using RSM.The simulations using ADAMS has been performed according to the cube model of CCD.By using MiniTAB,the model of response surface has been established based on the simulation results.The optimal conditions resulted from the response optimization tool of MiniTAB has been verified by being assigned to the prototype of MLCC alignment system.

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